SupermicroSBI-612B-1NE34-01-G2
Out of stock
FSI, AI, EDA, 3D Rendering & Simulation
SKU: SBI-612B-1NE34-01-G2
Features
Key Features
- CPU - Single Intel Xeon 6517P (16 (per node)-Cores, 3.2GHz)
- Chassis - 6U (SuperBlade 10-node)
- Drive - 1.92TB (1x 1.92TB M.2 NVMe) per node
- RAM - 4x 32GB DDR5-6400 (per node)
- Network Ports - Up to 4x 25G Ethernet switches
Use Cases
Enterprise Applications
High Performance Computing
Engineering/scientific research
Cloud, virtualization, financial, EDA
Motherboard
MBD-B14SBE-CPU-25G
System BIOS
GPU
System Memory
On-Board Devices
Input / Output
Processor
BIOS Type:
AMI 256MB SPI Flash EEPROM
GPU (Per Node)
Max GPU Count:
Up to 1 double-width or 2 single-width GPU(s) Compatible GPU List
System Memory (Per Node)
Memory Capacity:
16x DIMM slots (2DPC)
Up to 4TB DDR5ECC RDIMM/3DS-RDIMM, with speed 6400MT/s (1DPC) or 5200MT/s (2DPC) in 16 DIMM slots
Up to 512GB MRDIMM with speed 8000MT/s in 1DPC memory population
Up to 4TB DDR5ECC RDIMM/3DS-RDIMM, with speed 6400MT/s (1DPC) or 5200MT/s (2DPC) in 16 DIMM slots
Up to 512GB MRDIMM with speed 8000MT/s in 1DPC memory population
On-Board Devices (Per Node)
Chipset:
System on Chip
NVMe:
NVMe; RAID 0/1/5/10 support (Intel® VROC RAID key required)
Network Controllers:
Onboard Dual 25G Ethernet
1x expansion slot w/ optional mezzanine cards
1x expansion slot w/ optional mezzanine cards
Mgmt / Security:
IPMI 2.0 / KVM over IP / Redfish API/TPM 2.0/Signed Firmware/HW Root of Trust
Graphics:
Aspeed AST2600
TPM:
1x TPM Header
CPU:
Single Socket E2 (LGA-4710); Intel® Xeon® 6700/6500-series processors with P-cores or E-cores
Note:
Note: Up to 250W TDP CPUs (Air Cooled at 35°C)
Chassis
Front Panel
Expansion Slots
Drive Bays / Storage
Operating Environment
Dimensions
Environmental / Recycling
Buttons:
Power On/Off button
LEDs:
Power LED
UID
Network Activity LED
Fault LED
UID
Network Activity LED
Fault LED
Expansion Slots (Per Node)
PCIe:
2x PCIe Gen5 x16 slot, support 1 FHFL DW PCIe card or 2 SW PCIe cards
Drive Bays / Storage (Per Node)
M.2:
1x M.2 2280
Hot-swap:
4x Hot-swap E3.S drive bays
Environmental Spec.:
Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
Operating Relative Humidity: 8% to 80% (non-condensing)
Non-operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
Operating Relative Humidity: 8% to 80% (non-condensing)
Non-operating Relative Humidity: 8% to 90% (non-condensing)
Rohs:
RoHS Compliant
Height:
0.07 in
Width:
0.39 in
Depth:
0.94 in
Available Color:
N/A
Recycle:
Contact us at lifecycle@rackables.com for recycling options.
Part NumberQtyDescription
TPM security module (optional, not included)
AOM-TPM-9670V AOM-TPM-9671VTPM module (Vertical) TPM 2.0 TPM module (Vertical) TPM 1.2.
VROC
AOC-VROCPREMOD AOC-VROCSTNMODIntel VROC Premium, RAID 0, 1, 5, 10 Intel VROC HW key (RSTe) standard upgrade module
Heatsink / Retention
SNK-P0087V1U Passive CPU VC HS
CPU Carrier
SKT-1544H-0000-FXC SKT-1544H-0000-LTS SKT-1543H-0000-FXC SKT-1543H-0000-LTSSocket E2 E2B Carrier, LGA4710, GNR-SP HCC/LCC& SRF-SP, DG1.0, HF Socket E2, LGA4710-2, GNR-SP E2B Carrier, PC, Gray HSG, W/SHIM Socket E2 E2A Carrier, LGA4710, GNR-SP XCC, DG1.0, Cool Gray, HF Socket E2, LGA4710-2, GNR-SP E2A Carrier, PC, Gray HSG, W/O SHIM
Networking
AOC-B25G-6X4DDual-port 25G Mezz card for SuperBlade 6U Chassis (Mellanox ConnectX-4 Lx EN)AOC-B25G-6CVL25G DUAL PORT MEZZANINE CARD,Intel Columbiaville, E810-XXVAM2
Software
SFT-DCMS-SingleDataCenter Management Package (per node license)
Warranty & Support
Please visit the link for more information about Supermicro products warranty.
Resources
ManualsClick the button to download the latest manuals for this product.
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