SupermicroSYS-212H-TN-01-G2
$57,911.102U UP Hyper supporting up to 24 hot-swap 2.5” NVMe/SAS/SATA bays and up to 8 PCIe 5.0 + 2 PCIe 5.0 AIOM slots
SKU: SYS-212H-TN-01-G2
Features
Key Features
- CPU - Single Intel Xeon 6761P (32-Cores, 2.5GHz)
- Chassis - 2U
- Drive - 7.6TB (2x 3.8TB U.2 NVMe)
- RAM - 8x 128GB DDR5-6400
- Network Ports - 2-port 25GbE
Use Cases
Virtualization
Software-defined Storage
AI Inference and Machine Learning
Cloud Computing
Enterprise Server
Data Center Optimized
Database Processing and High Density Storage
Motherboard
Super X14SBH
System BIOS
GPU
System Memory
On-Board Devices
Input / Output
Management
Security
PC Health Monitoring
Processor
BIOS Type:
AMI 64MB SPI Flash
Max GPU Count:
Up to 4 double-width or 8 single-width GPUs
Supported GPU:
NVIDIA PCIe: H100 NVL, A10, H200 NVL (141GB), L4, L40S, NVIDIA RTX PRO™ 4500 Blackwell, NVIDIA RTX PRO™ 6000 Blackwell Max-Q Workstation Edition, RTX 4000 Ada Generation
Intel PCIe: Intel Data Center GPU Flex 170
Intel PCIe: Intel Data Center GPU Flex 170
CPU-GPU Interconnect:
PCIe 5.0 x16 CPU-to-GPU Interconnect
Memory:
Slot Count: 16 DIMM slots
Max Memory (1DPC): Up to 2TB 6400MT/s ECC DDR5 RDIMM
Max Memory (1DPC): Up to 512GB 8000MT/s ECC DDR5 MRDIMM
Max Memory (2DPC): Up to 4TB 5200MT/s ECC DDR5 RDIMM
Max Memory (1DPC): Up to 2TB 6400MT/s ECC DDR5 RDIMM
Max Memory (1DPC): Up to 512GB 8000MT/s ECC DDR5 MRDIMM
Max Memory (2DPC): Up to 4TB 5200MT/s ECC DDR5 RDIMM
Memory Voltage:
1.1V
NVMe:
NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required)
Chipset:
System on Chip
Network Connectivity:
Via AIOM
LAN:
1x RJ45 1 GbE Dedicated BMC LAN port
USB:
2x USB 3.2 Gen1 ports(Rear)
Video:
1x VGA port
Software:
SuperCloud Composer®
Supermicro Server Manager (SSM)
Super Diagnostics Offline (SDO)
Supermicro Thin-Agent Service (TAS)
SuperServer Automation Assistant (SAA) New!
Supermicro Server Manager (SSM)
Super Diagnostics Offline (SDO)
Supermicro Thin-Agent Service (TAS)
SuperServer Automation Assistant (SAA) New!
Power Configurations:
Power-on mode for AC power recovery
ACPI Power Management
ACPI Power Management
Hardware:
Trusted Platform Module (TPM) 2.0
Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features:
Cryptographically Signed Firmware
Secure Boot
Secure Firmware Updates
Automatic Firmware Recovery
Supply Chain Security: Remote Attestation
Runtime BMC Protections
System Lockdown
Secure Boot
Secure Firmware Updates
Automatic Firmware Recovery
Supply Chain Security: Remote Attestation
Runtime BMC Protections
System Lockdown
CPU:
Monitors for CPU Cores, Chipset Voltages, Memory
Fan:
Fans with tachometer monitoring
Pulse Width Modulated (PWM) fan connectors
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
Status monitor for speed control
Temperature:
Monitoring for CPU and chassis environment
Thermal Control for fan connectors
Thermal Control for fan connectors
CPU:
Single Socket E2 (LGA-4710); Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores
Cores:
P-cores: Up to 86C/172T; E-cores: Up to 144C/144T
Cache:
P-cores: Up to 336MB Cache; E-cores: Up to 108MB Cache
Note:
Supports up to 350W TDP CPUs (Air Cooled)
Chassis
Front Panel
Expansion Slots
Drive Bays / Storage
System Cooling
Operating Environment
Power Supply
Dimensions
Environmental / Recycling
Buttons:
Power On/Off
UID button
UID button
LED:
HDD activity
LAN1 activity
Power status
System information
LAN1 activity
Power status
System information
PCI-Express (PCIe) Configuration:
Option A*: 1 PCIe 5.0 x16 FHFL double-width slot; 1 PCIe 5.0 x16 FH/10.5"L double-width slot; 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
Option B*: 1 PCIe 5.0 x16 FHFL double-width slot; 2 PCIe 5.0 x8 FH/10.5"L slots; 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
Option C*: 4 PCIe 5.0 x16 (in x16) FHFL double-width slots; 1 PCIe 5.0 x16 (in x16) AIOM slot (OCP 3.0 compatible)
Option D*: 3 PCIe 5.0 x16 (in x16) FHFL double-width slots; 2 PCIe 5.0 x8 (in x16) FHFL slots; 1 PCIe 5.0 x16 (in x16) AIOM slot (OCP 3.0 compatible)
Option E*: 3 PCIe 5.0 x16 (in x16) FHFL double-width slots; 1 PCIe 5.0 x16 (in x16) AIOM slot (OCP 3.0 compatible)
Option F*: 1 PCIe 5.0 x16 (in x16) FHFL double-width slot; 1 PCIe 5.0 x16 (in x16) AIOM slot (OCP 3.0 compatible)
(*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)
Option B*: 1 PCIe 5.0 x16 FHFL double-width slot; 2 PCIe 5.0 x8 FH/10.5"L slots; 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
Option C*: 4 PCIe 5.0 x16 (in x16) FHFL double-width slots; 1 PCIe 5.0 x16 (in x16) AIOM slot (OCP 3.0 compatible)
Option D*: 3 PCIe 5.0 x16 (in x16) FHFL double-width slots; 2 PCIe 5.0 x8 (in x16) FHFL slots; 1 PCIe 5.0 x16 (in x16) AIOM slot (OCP 3.0 compatible)
Option E*: 3 PCIe 5.0 x16 (in x16) FHFL double-width slots; 1 PCIe 5.0 x16 (in x16) AIOM slot (OCP 3.0 compatible)
Option F*: 1 PCIe 5.0 x16 (in x16) FHFL double-width slot; 1 PCIe 5.0 x16 (in x16) AIOM slot (OCP 3.0 compatible)
(*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)
Drive Bays Configuration:
Default: Total 8 bays: 8 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays
Option A: Total 16 bays: 16 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays
Option B: Total 24 bays: 24 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays
(*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details)
Option A: Total 16 bays: 16 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays
Option B: Total 24 bays: 24 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays
(*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details)
M.2:
2x M.2 NVMe slots (M-key 2280/22110/25110; VROC required for RAID)
Fans:
Up to 6 counter-rotating 60x60x56mm Fan(s)
Air Shroud:
1x CPU Air Shroud
Environmental Spec.:
Operating Temperature: 10°C to 35°C (50°F to 95°F)
Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
2x 1200W
Description:
2x 1200W Redundant (1 + 1) Titanium Level (96%) power supplies
Dimension (W x H x L):
73.5 x 40 x 265 mm
Input:
800W: 100-127Vac 800W: 100-127Vac / 50-60Hz 1200W: 200-240Vac 1200W: 200-240Vac / 50-60Hz 1200W: 230-240Vdc / 50-60Hz (for CCC only)
+12V:
Max: 66.7A / Min: 0A (100Vac-127Vac) Max: 83A / Min: 0A (100Vac-127Vac) Max: 100A / Min: 0A (200Vac-240Vac) Max: 100A / Min: 0A (230Vdc-240Vdc) (for CCC only)
12V SB:
Max: 2.1A / Min: 0A
Output Type:
Backplanes (gold finger)
2x 1300W
Description:
2x 1300W Redundant (1 + 1) Gold (Certification Pending) Level power supplies
Dimension (W x H x L):
73.5 x 40 x 265 mm
Input:
1300W: -44--65Vdc / 50-60Hz
+12V:
Max: 108.3A / Min: 0A
12V SB:
Max: 2.1A
Output Type:
Backplanes (gold finger)
2x 1600W
Description:
2x 1600W Redundant (1 + 1) Titanium Level (96%) power supplies
Dimension (W x H x L):
73.5 x 40 x 265 mm
Input:
1000W: 100-127Vac 1000W: 100-127Vac / 50-60Hz 1600W: 200-240Vac 1600W: 200-240Vac / 50-60Hz 1600W: 200-240Vdc / 50-60Hz (for CQC only)
+12V:
Max: 83.3A / Min: 0A (100Vac-127Vac) Max: 133.3A / Min: 0A (200Vac-240Vac)
12V SB:
Max: 3.5A / Min: 0A Max: 3.5A
Output Type:
Backplanes (gold finger)
2x 2000W
Description:
2x 2000W Redundant (1 + 1) Titanium Level (96%) power supplies
Dimension (W x H x L):
73.5 x 40 x 265 mm
Input:
1000W: 100-127Vac / 50-60Hz 1800W: 200-220Vac / 50-60Hz 1980W: 220-230Vac / 50-60Hz 2000W: 230-240Vac / 50-60Hz 2000W: 220-240Vac / 50-60Hz (for UL only) 2000W: 230-240Vdc / 50-60Hz (for CQC only) 2700W: 200-240Vac
+12V:
Max: 83A / Min: 0A (100Vac-127Vac) Max: 150A / Min: 0A (200Vac-220Vac) Max: 165A / Min: 0A (220Vac-230Vac) Max: 166A / Min: 0A (230Vac-240Vac) Max: 225A / Min: 0A (200Vac-240Vac)
12V SB:
Max: 3.5A / Min: 0A
Output Type:
Backplanes (gold finger)
Height:
3.5 in
Width:
17.2 in
Depth:
31.74 in
Available Color:
Silver
Recycle:
Contact us at lifecycle@rackables.com for recycling options.
Part NumberQtyDescription
Cable Management Arm + Rail Set
MCP-290-00168-0N + MCP-290-11901-0N17.5" cable management arm + 41" long ball-bearing rail set
Drive Bay Configuration Options
Refer to User's Manual8, 16 & 24 drive bay configuration options for NVMe, SAS, or SATA support
Drive Tray Label
LBL-0968Pack of 4 "NVMe" labels for hot-swap drive tray
Front Bezel
MCP-210-21903-0B1Front bezel for 2U Hyper
Global Services & Support
OS4HR3/2/11Gold Level, 3/2/1-year onsite 24x7x4 SLAOSNBD3/2/11Silver Level, 3/2/1-year onsite NBD SLASMSAD3/2/11Bronze Level, 3/2/1-year 3BD SLA
PCIe Slot Configuration Options
Refer to User's ManualPCIe slot configuration options to enable PCIe slots 1-8
Rail Set
MCP-290-11901-0N141" ball-bearing rail set for Hyper serversMCP-290-11902-0N (included in the system )35.25" ball-bearing rail set for Hyper serversMCP-290-11903-0N130.5" ball-bearing rail set for Hyper servers
Software
SFT-DCMS-Single1DataCenter Management Package (per node license)SFT-SDDC-SINGLE1SuperCloud Composer (per node license)
Warranty & Support
Please visit the link for more information about Supermicro products warranty.
Resources
ManualsClick the button to download the latest manuals for this product.
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