Supermicro
$548,422.27SYS-822GS-NB3RT-01-G2
Discover unmatched performance for demanding artificial intelligence, deep learning, and high-performance computing applications with the Supermicro SYS-822GS-NB3RT-01-G2 Gold Series server. This powerful pre-configured 8U rackmount system is ready to deploy quickly right out of the box. It features dual Intel® Xeon® 6768P processors (128 cores / 2.4GHz), NVIDIA HGX™ B300 8-GPU platform, and 2TB DDR5-6400 memory for immediate high-density acceleration in next-generation data centers.
Engineered for intensive workloads including large language model training, generative AI, conversational AI, scientific research, drug discovery, financial modeling, and autonomous vehicle development, this Gold Series SuperServer delivers exceptional scalability. The NVIDIA HGX B300 8-GPU configuration with advanced 5th Generation NVLink provides up to 1.8TB/s bandwidth and massive high-bandwidth HBM3e GPU memory. Dual-socket Intel Xeon 6768P processors with 128 cores offer robust CPU performance, while the 2TB DDR5-6400 memory configuration ensures lightning-fast data processing for memory-intensive AI tasks.
High-speed networking is built in with the 8-port 800GbE/XDR800 networking adapter, delivering ultra-low latency and up to 800Gb/s throughput for distributed AI training and inference clusters. Storage includes a 960GB M.2 NVMe solid state drive for fast boot and reliable operation, with room for expansion via additional hot-swap bays. The redundant 6600W Titanium Level power supplies provide maximum reliability and energy efficiency for 24/7 enterprise deployments.
Experience the future of accelerated computing with the Supermicro SYS-822GS-NB3RT-01-G2 Gold Series pre-configured SuperServer — delivering enterprise-ready specs designed for rapid deployment and maximum throughput in today’s most advanced AI infrastructures.
SKU: SYS-822GS-NB3RT-01-G2
Features
Key Features
- CPU - Dual Intel® Xeon® 6768P Processor (64-Cores)
- GPU - NVIDIA HGX GPU Baseboard 8 B300 NVL8
- Chassis - 8U Rackmount
- Drive - 1x 960GB M.2 NVMe
- RAM - 16x 128GB DDR5-6400 RDIMM Memory
Use Cases
Scientific Research
Conversational AI
Business Intelligence & Analytics
Drug Discovery
Finance Services and Fraud Detection
AI/Deep Learning Training and Inference
Large Language Model (LLM) and Generative AI
High Performance Computing (HPC)
Autonomous Vehicle Technologies
Motherboard
Super X14DBG-LC
GPU
Input / Output
Management
On-Board Devices
PC Health Monitoring
Processor
Security
System BIOS
System Memory
GPU-GPU Interconnect:
NVIDIA® NVLink™ with NVSwitch™
Max GPU Count:
8x onboard GPUs
Supported GPU:
NVIDIA SXM: HGX B300 8-GPU (288GB)
LAN:
8x OSFP 800 GbE LAN ports (NVIDIA ConnectX®-8 SuperNIC)
2x RJ45 10 GbE LAN ports (Intel® X710)
2x RJ45 10 GbE LAN ports (Intel® X710)
USB:
1x USB 3.0 Type-A port(Front)
1x USB 2.0 Type-A port(Front)
1x USB 2.0 Type-A port(Front)
Video:
1x VGA port
1x mini-DP port
1x mini-DP port
Power Configurations:
Power-on mode for AC power recovery
ACPI Power Management
ACPI Power Management
Software:
SuperCloud Composer®
Supermicro Server Manager (SSM)
Super Diagnostics Offline (SDO)
Supermicro Thin-Agent Service (TAS)
SuperServer Automation Assistant (SAA) New!
Supermicro Server Manager (SSM)
Super Diagnostics Offline (SDO)
Supermicro Thin-Agent Service (TAS)
SuperServer Automation Assistant (SAA) New!
Chipset:
System on Chip
Network Connectivity:
8x OSFP 800GbE
2x RJ45 10GbE
2x RJ45 10GbE
CPU:
8+4 Phase-switching voltage regulator
Monitors for CPU Cores, Chipset Voltages, Memory
Monitors for CPU Cores, Chipset Voltages, Memory
Fan:
Fans with tachometer monitoring
Pulse Width Modulated (PWM) fan connectors
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
Status monitor for speed control
Temperature:
Monitoring for CPU and chassis environment
Thermal Control for fan connectors
Thermal Control for fan connectors
Core Count:
Up to 86C/172T; Up to 336MB Cache per CPU
CPU:
Dual Socket E2 (LGA-4710)
Intel® Xeon® 6700-series processors with P-cores
Intel® Xeon® 6700-series processors with P-cores
Note:
Supports up to 350W TDP CPUs (Air Cooled)
Features:
Cryptographically Signed Firmware
Secure Boot
Secure Firmware Updates
Automatic Firmware Recovery
Supply Chain Security: Remote Attestation
Runtime BMC Protections
System Lockdown
Secure Boot
Secure Firmware Updates
Automatic Firmware Recovery
Supply Chain Security: Remote Attestation
Runtime BMC Protections
System Lockdown
Hardware:
Trusted Platform Module (TPM) 2.0
Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Silicon Root of Trust (RoT) – NIST 800-193 Compliant
BIOS Type:
AMI 64MB UEFI
Memory:
Slot Count: 32 DIMM slots
Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM
Max Memory (2DPC): Up to 8TB 5200MT/s ECC DDR5 RDIMM
Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM
Max Memory (2DPC): Up to 8TB 5200MT/s ECC DDR5 RDIMM
Memory Voltage:
1.1V
Chassis
CSE-GP807TS-R000NP
Dimensions
Expansion Slots
Form Factor
Front Panel
Model
Operating Environment
Power Supply
Storage
System Cooling
Environmental / Recycling
Available Color:
Silver
Depth:
37.4 in
Gross Weight:
302.03 lb
Height:
13.8 in
Net Weight:
263.01 lb
Package Depth:
50.39 in
Package Height:
26.38 in
Package Width:
28.74 in
Width:
17.6 in
PCI-Express (PCIe) Configuration:
Default
2x PCIe 5.0 x16 FHHL slots
2x PCIe 5.0 x16 FHHL slots
Form Factor:
Rackmount
Buttons:
Power On/Off
UID
UID
LED:
HDD activity
LAN1 activity
LAN2 activity
Power Fail
Power status
System information (overheat/UID)
LAN1 activity
LAN2 activity
Power Fail
Power status
System information (overheat/UID)
Model:
CSE-GP807TS-R000NP
Environmental Spec.:
Operating Temperature: 10°C to 35°C (50°F to 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
6x 6600W Titanium
+12V:
Max: 130A / Min: 0A (200Vac-207.9Vac)
Max: 130A / Min: 0A (208Vac-219.9Vac)
Max: 130A / Min: 0A (220Vac-229.9Vac)
Max: 130A / Min: 0A (230Vac-238.9Vac)
Max: 130A / Min: 0A (239Vac-240Vac)
Max: 130A / Min: 0A (208Vac-219.9Vac)
Max: 130A / Min: 0A (220Vac-229.9Vac)
Max: 130A / Min: 0A (230Vac-238.9Vac)
Max: 130A / Min: 0A (239Vac-240Vac)
12V SB:
Max: 4A / Min: 0A
Certification:
Titanium Level
Description:
6x 6600W Redundant (3 + 3) Titanium Level (96%) power supplies
Dimension (W x H x L):
106.5 x 82.1 x 245.3 mm
Input:
5900W: 200-207.9Vac / 50-60Hz
6000W: 208-219.9Vac / 50-60Hz
6300W: 220-229.9Vac / 50-60Hz
6500W: 230-238.9Vac / 50-60Hz
6600W: 239-240Vac / 50-60Hz
6000W: 208-219.9Vac / 50-60Hz
6300W: 220-229.9Vac / 50-60Hz
6500W: 230-238.9Vac / 50-60Hz
6600W: 239-240Vac / 50-60Hz
Output Type:
Backplanes (gold finger)
Drive Bays
Configuration 1
Count:
8
Form Factor:
E1.S
Location:
front
Option:
default
Interface
Configuration 1
Interface:
NVMe
M.2
Count:
2
Keys
Configuration 1
Keys:
M
Fans:
Up to 12 heavy duty fans with optimal fan speed control
Recycle:
Contact us at lifecycle@rackables.com for recycling options.
Warranty & Support
Please visit the link for more information about Supermicro products warranty.
Resources
Manuals
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